Autors: Tsenev, V. P., Videkov, V. H., Spasova, N. V.
Title: Measurement of PCB deformation during parametric testing and evaluation of the impact on the installed components
Keywords: electronic modules, standard, parametric testing, deformations, statistics

Abstract: Using the IPC / JEDEC-9704 and KEMET-MLCC (Multilayer Ceramic Chip Capacitors) Fex Failure Rate standards is a defined area of critical deformation in parametric testing of circuit boards. An intelligent measuring system was used to measure and determine the deformation, as well as a methodology for conducting experimental measurements. The results of practical studies of deformations in parametric testing of electronic modules on a panel for a specific automotive product are presented. A conclusion is made using the obtained results with conclusions about the acceptability of the process according to the standard and analysis of the transients in parametric testing .

References

    Issue

    XXX International Scientific Conference Electronics - ET2021, 2021, Bulgaria, DOI 10.1109/ET52713.2021.9579659

    Full text of the publication

    Цитирания (Citation/s):
    1. Gulhan Ustabas Kaya, “Development of hybrid optical sensor based on deep learning to detect and classify the micro-size defects in printed circuit board”, December 2022, Measurement, DOI: 10.1016/j.measurement.2022.112247, IF 5.131, SJR 0.996 - 2022 - в издания, индексирани в Scopus или Web of Science

    Вид: пленарен доклад в международен форум, публикация в реферирано издание, индексирана в Scopus