Autors: Tsenev, V. P., Videkov, V. H., Spasova, N. V.
Title: Measurement of PCB deformation during parametric testing and evaluation of the impact on the installed components
Keywords: electronic modules, standard, parametric testing, deformatio

Abstract: Using the IPC / JEDEC-9704 and KEMET-MLCC (Multilayer Ceramic Chip Capacitors) Fex Failure Rate standards is a defined area of critical deformation in parametric testing of circuit boards. An intelligent measuring system was used to measure and determine the deformation, as well as a methodology for conducting experimental measurements. The results of practical studies of deformations in parametric testing of electronic modules on a panel for a specific automotive product are presented. A conclusion is made using the obtained results with conclusions about the acceptability of the process according to the standard and analysis of the transients in parametric testing .

References

    Issue

    XXX International Scientific Conference Electronics - ET2021, 2021, Bulgaria, DOI 10.1109/ET52713.2021.9579659

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    Цитирания (Citation/s):
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    Вид: пленарен доклад в международен форум, публикация в реферирано издание, индексирана в Scopus