Autors: Angelov, G. V., Dobrichkov, B. D., Liou, J.J.
Title: Thermal Analysis of ESD Diode in FDSOI Technology using COMSOL Multiphysics
Keywords: Behavior prediction, COMSOL, Comsol multiphysics, Developing process, Diode characteristics, ESD protection, FDSOI, Fully depleted silicon-on-insulator

Abstract: Device simulators are well-established tools for behavior prediction of novel electronic structures. However, the developing process for electrostatic discharge (ESD) devices strongly relies on tape-out measurements and adjustments on well-known IPs, rather than on pure TCAD simulation results. Part of the reasons are concerns over accuracy when fast transient events are simulated and high temperatures are reached. This paper provides data on thermal analysis of ESD diode characteristics in fully depleted silicon on insulator (FDSOI) technology using an unorthodox simulation tool - COMSOL Multiphysics.

References

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    28th International Scientific Conference Electronics, ET 2019 - Proceedings, Sozopol, Bulgaria, 12 September 2019 through 14 September 2019, pp. Article number 887866, 2019, Bulgaria, IEEE, DOI 10.1109/ET.2019.8878662

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    Вид: пленарен доклад в международен форум, публикация в реферирано издание, индексирана в Scopus