Autors: Bratovanov, N. G.
Title: Implementation of pick-and-place algorithms for the purposes of wafer handling robotics simulations
Keywords: pick-and-place, wafer handling robotics, object manipulation, robot motion simulation, offline programming, SolidWorks API

Abstract: An approach for efficient pick-and-place robotics simulations based on 3D CAD software has been proposed in the paper. Oriented specifically towards wafer handling robots, the development requires the implementation of several algorithms, whose main tasks are associated with determining the proximity between the robot’s end-effector and the silicon wafers, as well as checking the end-effector’s vacuum state. As a result, realistic object manipulations, closely matching the real-world substrate handling process can be performed, analyzed and evaluated in a completely virtual environment. The proposed approach has been successfully adapted to an already existing robot simulator based on SolidWorks API and Visual Basic .NET programming.


  1. K. Mathia and M. P. Aalund, “Robotics for electronics manufacturing in cleanroom environments,” Next Wave Of Technology Workshop, July 2010
  2. H. Chen, H. Cheng and B. Mooring, "Improving wafer handling performance in semiconductor manufacturing," Industrial Robot, vol. 40, No. 5, pp. 425–432, August 2013
  3. M. Cong, Y. Du, B. Shen and L. Jin, “Robotic wafer handling systems for integrated circuit manufacturing: A review,”, pp. 261–266, May 2007
  4. M. Cong and D. Cui, “Wafer-Handling Robots and Applications,” Recent Patents on Engineering, vol. 3, issue 3, pp. 170–177, 2009
  5. N. Bratovanov, “Robot Modeling, Motion Simulation and Off-line Programming Based on SolidWorks API,” Third IEEE International Conference on Robotic Computing (IRC), pp. 574–579, March 2019
  6. G. Fisher, M. R. Seacrist and R. W. Standley, "Silicon Crystal Growth and Wafer Technologies," Proceedings of the IEEE, vol. 100, no. Special Centennial Issue, pp. 1454–1474, May 2012
  7. Y. Liu, M. Xu and Y. Cao, "Research, design and experiment of end effector for wafer transfer robot", Industrial Robot, vol. 39, no. 1, pp. 79–91, 2012


HORA 2021 - 3rd International Congress on Human-Computer Interaction, Optimization and Robotic Applications, 2021, Turkey,

Full text of the publication

Вид: пленарен доклад в международен форум, публикация в реферирано издание, индексирана в Scopus