Autors: Stoynov, A. V., Bonev, B. B., Andreev, S. K., Spasova, N. R.
Title: Non-destructive Thermal Diagnostics of Multilayer Substrates for Multichip Modules
Keywords: Strips , Multichip modules , Inspection , Nonhomogeneous media , Thermal conductivity , Dielectric measurement , Reliability

Abstract: The aim of the research is to develop a methodology for thermal non-destructive diagnostics of defects on metal layers hidden in multilayer substrates for multichip modules using lock-in thermography. The results of thermal modelling and information about the used technology are presented, in which an organic dielectric material with laminated copper foil is used to realize the conductive layers in MCM substrates. Lock-in thermography simulation of five-layer with artificial defects samples has been performed. The results of digital thermal modelling have been verified by thermography measurements. Experiment results show that the lock-in thermography method can perform fast defect inspection in substrate layers with accuracy is about 95%.



    23rd Electronics Packaging Technology Conference (EPTC), pp. 85-90, 2021, Singapore, IEEE, DOI 10.1109/EPTC53413.2021.9663919

    Вид: публикация в международен форум, публикация в реферирано издание, индексирана в Scopus и Web of Science