Autors: Stoynova, A. V., Georgiev, N., Erinin, A., Bonev, B. B.
Title: Hidden solder joints inspection used in surface-mount technology
Keywords: hidden solder joints, quality of SMT, reflow processes

References

    Issue

    Proceedings of the International Spring Seminar on Electronics Technology, issue 2016, pp. 154-159, 2016, Czech Republic,

    Цитирания (Citation/s):
    1. Fan, F., Wang, B., Zhu, G., Efficient Faster R-CNN: Used in PCB Solder Joint Defects and Components Detection, 2021 IEEE 4th International Conference on Computer and Communication Engineering Technology, CCET 2021, pp. 1-5 - 2021 - в издания, индексирани в Scopus или Web of Science

    Вид: постер/презентация в международен форум, публикация в издание с импакт фактор, публикация в реферирано издание, индексирана в Scopus и Web of Science