| Autors: Tsenev, V. P., Videkov, V. H., Spasova, N. V. Title: Measurement of PCBA (Printed circuit board assembly) deformation during functional testing of electronic modules Keywords: measuring system, measurement, deformation, testing Abstract: With an intelligent measuring system, the PCBA (Printed circuit board assembly) deformation was prepared and measured during a functional test of a product. An area of critical deformation is defined based on the standards for testing in surface mounting. The used intelligent measuring system and its setting are described. The results of practical measurements of deformations during functional testing of a specific product are presented. A conclusion is made on the basis of the obtained results with conclusions regarding the admissibility of the process according to the standard. References Issue
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Цитирания (Citation/s):
1. Friškovec, Nejc; Obreza, Manja; Seme, Sebastijan; Sredenšek, Klemen, “MEASUREMENT DEVICE FOR TESTING PRINTED CIRCUIT BOARD ASSEMBLIES COMING OFF THE PRODUCTION LINE”, Journal of Energy Technology; Krsko Vol. 15, Iss. 3, (Nov 2022): 65-74, Maribor, Slovenia - 2022 - от чужди автори в чужди издания, неиндексирани в Scopus или Web of Science
2. Nikolay Petkov, Malinka Ivanova, „Printed circuit board and printed circuit board assembly methods for testing and visual inspection: a review“, Bulletin of Electrical Engineering and Informatics, 13(4):2566-2585, August 2024, DOI: 10.11591/eei.v13i4.7601 - 2024 - в издания, индексирани в Scopus и/или Web of Science
Вид: пленарен доклад в международен форум, публикация в реферирано издание, индексирана в Scopus
