| Autors: Tsenev, V. P., Videkov, V. H., Spasova, N. V. Title: Installation of electronic modules in a housing by means of a screw assembly and assessment of the influence of the deformation of the PCB on the installed components Keywords: assembly, standard, measurement, testing, deformations Abstract: Based on the standard for testing in surface mounting, an area of critical deformation is determined when mounting electronic modules in a housing (box). A methodology for testing and determining the deformation has been chosen, as well as tools for conducting experimental measurements. The results of practical measurements of deformations during assembly of electronic modules in a housing are presented. A conclusion is made on the basis of the obtained results with conclusions regarding the admissibility of the process according to the standard. References Issue
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Вид: пленарен доклад в международен форум, публикация в реферирано издание, индексирана в Scopus
