Autors: Tzaneva, B. R., Georgieva, M. G., Lazarova D., Petrova M.
Title: Uniformity of Electrochemical Deposition on Thin Copper Layers
Keywords: Electrochemical Deposition, Thin Copper Layer, Electroless D

References

    Issue

    Proc. XXX International Scientific Conference Electronics - ET2021, 2021, Bulgaria, IEEE, DOI 10.1109/ET52713.2021.9579652

    Цитирания (Citation/s):
    1. J.H. Huang, P.S. Shih, V. Renganathan, S.J. Grӓfner, Y.A. Chen, C.H. Huang, C.L. Kao, Y.S. Lin, Y.C. Hung, C.R. Kao, Development of high copper concentration, low operating temperature, and environmentally friendly electroless copper plating using a copper ‐ glycerin complex solution, Electrochimica Acta, 425, (2022), pp. 140710 - 2022 - в издания, индексирани в Scopus или Web of Science
    2. V. Tsenev, N. Peshev, V. Videkov, "Improving the Tensile Strength of Solders by Stabilizing them with Coatings and Using Statistics", Proceedings of 36th International Conference on Information Technologies - InfoTech 2022, (2022), ISBN: 978-166546870-1, DOI: 10.1109/InfoTech55606.2022.9897106 - 2022 - в издания, индексирани в Scopus или Web of Science

    Вид: постер/презентация в международен форум, публикация в реферирано издание, индексирана в Scopus