Autors: Tsenev, V. P., Videkov, V. H., Pavlov Br.
Title: Measurement of the deformation of PCB and SMD during surface mounting
Keywords: surface mounting, soldering, testing, deformation

Abstract: Based on the standard for testing in surface mounting, an area of critical deformation during the assembly of elements has been determined. A methodology for testing and determining the deformation has been chosen, as well as tools for conducting experimental measurements. The results of practical measurements of deformations after soldering are presented. A conclusion is made on the basis of the obtained results with conclusions regarding the admissibility of the process according to the standard.

References

    Issue

    12th NATIONAL CONFERENCE WITH INTERNATIONAL PARTICIPATION "ELECTRONICA 2021, 2021, Bulgaria, DOI 10.1109/ELECTRONICA52725.2021.9513715

    Full text of the publication

    Вид: пленарен доклад в международен форум, публикация в реферирано издание, индексирана в Scopus