|Autors: Tsenev, V. P., Videkov, V. H., Pavlov Br.|
Title: Measurement of the deformation of PCB and SMD during surface mounting
Keywords: surface mounting, soldering, testing, deformation
Abstract: Based on the standard for testing in surface mounting, an area of critical deformation during the assembly of elements has been determined. A methodology for testing and determining the deformation has been chosen, as well as tools for conducting experimental measurements. The results of practical measurements of deformations after soldering are presented. A conclusion is made on the basis of the obtained results with conclusions regarding the admissibility of the process according to the standard.
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Вид: пленарен доклад в международен форум, публикация в реферирано издание, индексирана в Scopus