Autors: Venev, P. H., Stefanov, B. I., Milusheva, V. S., Tzaneva, B. R., Videkov, V. H.
Title: Fabrication of Conductive Copper Patterns Using Photocatalyst-activated Electroless Deposition
Keywords: anodic aluminum oxide, electroless deposition, conductive patterns, photocatalysis, titanium dioxide

Abstract: The paper presents a noble-metal-free procedure for selective electroless deposition of copper patterns on a porous anodic alumina substrate. The substrate was functionalized with titanium dioxide capping layer via sol-gel dip-coating to improve its chemical stability in an alkaline copper plating electrolyte (pH>13). The photocatalytic activity of the titanium dioxide allows for selective deposition of copper seeds by UV lithography. The seed layer can then develop into a conductive pattern inside the same plating electrolyte. The work studies the effects of UV-irradiation and electroless deposition duration on the sheet resistance and wettability of the copper surface by three types of solder pastes.

References

    Issue

    2021 12th National Conference with International Participation (ELECTRONICA), pp. 1-4, 2021, Bulgaria, IEEE, DOI 10.1109/ELECTRONICA52725.2021.9513710

    Вид: постер/презентация в национален форум с межд. уч., публикация в реферирано издание, индексирана в Scopus