Autors: Venev, P. H., Stefanov, B. I., Milusheva, V. S., Tzaneva, B. R., Videkov, V. H.
Title: Fabrication of Conductive Copper Patterns Using Photocatalyst-activated Electroless Deposition
Keywords: anodic aluminum oxide, electroless deposition, conductive patterns, photocatalysis, titanium dioxide

Abstract: The paper presents a noble-metal-free procedure for selective electroless deposition of copper patterns on a porous anodic alumina substrate. The substrate was functionalized with titanium dioxide capping layer via sol-gel dip-coating to improve its chemical stability in an alkaline copper plating electrolyte (pH>13). The photocatalytic activity of the titanium dioxide allows for selective deposition of copper seeds by UV lithography. The seed layer can then develop into a conductive pattern inside the same plating electrolyte. The work studies the effects of UV-irradiation and electroless deposition duration on the sheet resistance and wettability of the copper surface by three types of solder pastes.



    2021 12th National Conference with International Participation (ELECTRONICA), pp. 1-4, 2021, Bulgaria, IEEE, DOI 10.1109/ELECTRONICA52725.2021.9513710

    Вид: постер/презентация в национален форум с межд. уч., публикация в реферирано издание, индексирана в Scopus