Autors: Andonova, A. V.
Title: Comparison of transient thermography methods for defect detecting in electronic components and modules
Keywords: fault diagnostic, transient thermography, electronic compone

Abstract: The article examines different methods of transient thermography applied to analyze the faults and detection of hidden defects in electronic components and modules. A brief analysis of the methods and recommendations for their application is presented. A systematic approach to designing a transient thermographic measurement system for the detection and analysis of faults and hidden defects in electronic components and modules is developed. Some experimental results are shown.

References

    Issue

    Int. J. of Applied Mathematics, Computational Science and Systems Engineering, vol. 3, pp. 94-98, 2021, United Kingdom, International Academic Publications, ISSN 2766-9823

    Full text of the publication

    Цитирания (Citation/s):
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    Вид: статия в списание, публикация в реферирано издание, индексирана в Google Scholar