Autors: Tsenev, V. P., Videkov, V. H.
Title: Approach to reduce PCB distortion after heat treatment for soldering with reflow process
Keywords: reflow, soldering, disrortion

References

    Issue

    XXIX International Scientific Conference Electronics - ET2020", 2020, Bulgaria, DOI: 10.1109/ET.2020.9238213

    Вид: пленарен доклад в международен форум, публикация в реферирано издание, индексирана в Scopus