Autors: Andonova, A. V., Yordanov, R. S., Yordanova, I. R.
Title: Thermal stability analysis of power LED during aging
Keywords: Temperature measurement , Light emitting diodes , Junctions , Electronic packaging thermal management , Thermal resistance , Aging , Degradation

Abstract: The aim of this work is to analyze thermal stability by lifetime accelerated tests for three different constructions of LED lighting fixtures. As a result of the study, information on the role of temperature in determining device degradation is provided, since in most cases high current and high temperatures acted as degradation driving forces. In order to highlight the influence of the aging tests on the LEDs, we firstly measured their characteristics at the initial state and then the measurements were carried out in a cyclical way after every aging step. The accelerated current test implied a faster degradation than the constant thermal stress: even if the degradation modes were similar for both stress and appeared to be thermally activated, the high carrier flow acted as an acceleration factor on the failure of devices. These results underline that package design in terms of heat dissipation is significant for devices with a longer lifetime and is an essential requirement for the s



    34th International Spring Seminar on Electronics Technology (ISSE2011), pp. 274- 278, 2011, Slovakia, IEEE, DOI 2161-2528/10.1109/ISSE.2011.6053872

    Цитирания (Citation/s):
    1. Vairavan, R., Retnasamy, V., Sauli, Z., Kamarudin, H., LED heat dissipation study using different Cu slug size, Advances in Environmental Biology vol. 7, no 12 S2, (SPEC. ISSUE 12), 2013, pp. 3672-3676, ISSN:1995-0756, SJR=0.114 - 2013 - в издания, индексирани в Scopus или Web of Science
    2. Deepak Chandran, Haricharan Kannan, The Effect of Thermal Interface Material on Led Heat Sinks, Journal of Advanced Research in Applied Mechanics & Computational Fluid Dynamics, Volume 5, Issue 1&2, 2018, pp. 1-5,, ISSN: 2394-7055 - 2018 - от чужди автори в чужди издания, неиндексирани в Scopus или Web of Science
    3. Ling Huey Lin Joyce, Thermal modeling and characterization of high-power devices, National University of Singapore, 2014, pp.274, Dissertation - 2014 - от чужди автори в чужди издания, неиндексирани в Scopus или Web of Science

    Вид: пленарен доклад в международен форум, публикация в издание с импакт фактор, публикация в реферирано издание, индексирана в Scopus и Web of Science