Autors: Stoynova, A. V., Angelov, G. V., Chernev P.
Title: Diagnostics of packaged ICs by infrared thermography
Keywords: Integrated circuits , Temperature measurement , Electronic packaging thermal management , Heating , Circuit faults , Transient analysis , Temperature distribution

References

    Issue

    37th International Spring Seminar on Electronics Technology (ISSE 2014), pp. 261-266, 2014, Germany, IEEE, DOI 10.1109/ISSE.2014.6887605

    Цитирания (Citation/s):
    1. Danjiang Chen, Yutian Liu, Wei Zhang, Minhua Zheng, Shaozhong Zhang, Detection of IGBT degradation in NPC inverter based on infrared thermography, Journal of Computational Methods in Sciences and Engineering, Volume 18, Issue 2, 2018, pp. 459-468, ISSN: 14727978, DOI: 10.3233/JCM-180801 - 2018 - в издания, индексирани в Scopus или Web of Science
    2. Swapnil Suryakant Salvi, Ankur Jain, Detection of Unusual Thermal Activities in a Semiconductor Chip Using Backside Infrared Thermal Imaging, J. Electron. Packag. Jun 2021, 143(2), Paper No: EP-20-1058 (8 pages), DOI: https://doi.org/10.1115/1.4049291, SJR(Q2)=0,657 - 2021 - в издания, индексирани в Scopus или Web of Science
    3. LINXEN Yun-fei, YAO Ruo-he, Defect Localization Method of 3D Stacked-Die Packaged Integrated Circuits, Journal of South China University of Technology (Natural Science Edition), Vol. 44, no 5, pp.36-46, 2016, doi: 10.3969/j.issn.1000-565X.2016.05.006 - 2016 - от чужди автори в чужди издания, неиндексирани в Scopus или Web of Science

    Вид: пленарен доклад в международен форум, публикация в издание с импакт фактор, публикация в реферирано издание, индексирана в Scopus и Web of Science