Autors: Videkov, V. H., Radonov, R. I.
Title: New Considerations for the Design of IC Bond Pads Using CAD Systems
Keywords: CAD, IC design, bond pads

Abstract: This paper presents the characteristics in the design of the contact pads of integrated circuits as a result of the development of assembly technology. The emergence of new technologies leads to changes in layout requirements not only to the bond pads, but to the layout of integrated circuit as a whole. Below are the new peculiarities associated with the introduction of the stacked-die assembly and assembly using passage holes in the semiconductor crystal.


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ANNUAL JOURNAL OF ELECTRONICS, vol. 6, issue 2, pp. 46 - 48, 2012, Bulgaria, TU - Sofia

Вид: постер/презентация в международен форум, публикация в реферирано издание