Autors: Tzanova, S. S.
Title: Thermal analysis of high power LED bulb. comparison between aluminum, ceramic and stainless steel package-on-substrates
Keywords: CFD simulations, High power LED, Thermal simulations

Abstract: In this paper, the thermal analysis of 3 different package-on-substrates for light emitting diode (LED) bulb is presented. The same aluminum heat sink was used for all simulations. The results are obtained using CFD simulation software



    28th International Scientific Conference Electronics, 12 September 2019 through 14 September 2019, vol. ET 2019 - Proceedings, issue 28, pp. Article number 8878320, 2019, Bulgaria, Institute of Electrical and Electronics Engineers Inc., DOI 10.1109/ET.2019.8878320

    Copyright IEEE

    Вид: пленарен доклад в международен форум, публикация в реферирано издание, индексирана в Scopus