Autors: Kafadarova N., Andonova, A. V.
Title: PCB Thermal design improvement through thermal vias
Keywords: Thermal simulation, CFD, PCB, Thermal vias, Thermal resistance, Thermography

Abstract: An approach based on the design of different experiments for improving the thermal paths in PCB through thermal vias is offered. An efficient thermal via placed on the PCB decreases the junction temperature of the package. In this paper elaborate study has been done in analyzing the effect of thermal vias and the ways to decrease the junction temperature by a given number of computations. Thermal enhancement has been achieved by running the thermal simulations with and without thermal vias. Temperature profiles have been plotted in FLOTHERM. The thermal enhancement study focuses on the importance of thermal vias to a great extent. The simulation models are validated with experiments.

References

    Issue

    Recent advances in circuits, systems, electronics, control and signal processing, pp. 241-244, 2009, Spain, WSEAS Press, ISBN ISSN 1790-5117; ISBN 978-960-474-139-7

    Full text of the publication

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    Вид: пленарен доклад в международен форум, публикация в реферирано издание, индексирана в Web of Science