Autors: Kafadarova N., Andonova, A. V.
Title: PCB Thermal design improvement through thermal vias
Keywords: Thermal simulation, CFD, PCB, Thermal vias, Thermal resistan

Abstract: An approach based on the design of different experiments for improving the thermal paths in PCB through thermal vias is offered. An efficient thermal via placed on the PCB decreases the junction temperature of the package. In this paper elaborate study has been done in analyzing the effect of thermal vias and the ways to decrease the junction temperature by a given number of computations. Thermal enhancement has been achieved by running the thermal simulations with and without thermal vias. Temperature profiles have been plotted in FLOTHERM. The thermal enhancement study focuses on the importance of thermal vias to a great extent. The simulation models are validated with experiments.

References

    Issue

    Recent advances in circuits, systems, electronics, control and signal processing, pp. 241-244, 2009, Spain, WSEAS Press, ISBN ISSN 1790-5117; ISBN 978-960-474-139-7

    Full text of the publication

    Цитирания (Citation/s):
    1. Gautam, D., Wager, D., Musavi, F., Edington, M., Eberle, W., Dunford, W.G., A Review of Thermal Management in Power Converters with Thermal Vias, Book Series: Annual IEEE Applied Power Electronics Conference and Exposition (APEC), 6520276, pp. 627-632, 2013, ISBN: 978-146734354-1, DOI: 10.1109/APEC.2013.6520276 - 2013 - в издания, индексирани в Scopus или Web of Science
    2. Gautam, D., Wager, D., Edington, M., Musavi, F.,Performance comparison of thermal interface materials for power electronics applications, Book Series: Annual IEEE Applied Power Electronics Conference and Exposition (APEC), 6803814, pp. 3507-3511, 2014, ISBN: 978-147992325-0, DOI: 10.1109/APEC.2014.6803814 - 2014 - в издания, индексирани в Scopus или Web of Science
    3. Gautam, D.S., Musavi, F., Wager, D., Edington, M., A comparison of thermal vias patterns used for thermal management in power converter, Book Series: IEEE Energy Conversion Congress and Exposition, 6646981, pp. 2214-2218, 2013, ISBN: 978-147990335-1, DOI: 10.1109/ECCE.2013.6646981 - 2013 - в издания, индексирани в Scopus или Web of Science
    4. Beng, A.L.Y., Hong, G.S., Devarajan, M., Optimization of thermal vias for thermal resistance in FR-4 PCBs, Proceedings of the 5th Asia Symposium on Quality Electronic Design (ASQED), 6643611, pp. 345-349, 2013, ISBN: 978-147991314-5, DOI: 10.1109/ASQED.2013.6643611 - 2013 - в издания, индексирани в Scopus или Web of Science
    5. Beng, A.L.Y., Hong, G.S., Devarajan, M., Numerical analysis of printed circuit board with thermal vias: Heat transfer characteristics under nonisothermal boundary conditions, Journal of Electronics Cooling and Thermal Control, vol 03, no 4, 2013, pp. 136-143, DOI: 10.4236/jectc.2013.34015, ISSN: 2162-6162 - 2013 - в издания, индексирани в Scopus или Web of Science
    6. T. Mushiri and C. Mbohwa,6th Int'l Conference on Mechanical, Production & Automobile Engineering (ICMPAE'2014) Nov. 27-28, 2014 Cape Town ,South Africa, pp. 16-20,PSRC, ISBN 978-93-84468-08-8 - 2014 - от чужди автори в чужди издания, неиндексирани в Scopus или Web of Science
    7. Jia J., Feng S., Deng B., Meng Q., Zhang Y., Transfer heat performance of PCB based on thermal resistance measurement, Diangong Jishu Xuebao/Transactions of China Electrotechnical Society 29(9), pp. 239-244, 2014, ISSN: 10006753, SJR (Q1) = 0.673 - 2014 - в издания, индексирани в Scopus или Web of Science
    8. S. Subramani, M. Devarajan, Testing and Analysis of Boron-Doped Aluminum Nitride Thin-Film-Coated Al as Thermal Substrates in PCB Fabrication for LED Application, IEEE TRANSACTIONS ON ELECTRON DEVICES Vol. 63, Issue 12, pp. 4839-4844, 2016, ISSN: 0018-9383, DOI: 10.1109/TED.2016.2620519,IF:2,62, SJR=0.839 - 2016 - в издания, индексирани в Scopus или Web of Science
    9. Umut Zeynep Uras, Enes Tamdoğan, Mehmet Arık, Thermal Enhancement of an LED Light Engine for Automotive Exterior Lighting With Advanced Heat Spreader Technology, ASME 2016 International Mechanical Engineering Congress and Exposition, November 11–17, 2016, USA, Volume 10: Micro- and Nano-Systems Engineering and Packaging, ISBN: 978-0-7918-5064-0, https://doi.org/10.1115/IMECE2016-65602 - 2016 - в издания, индексирани в Scopus или Web of Science
    10. 10. Uras, U.Z., Arik, M., Tamdoǧan, E.,Thermal performance of a light emitting diode light engine for a multipurpose automotive exterior lighting system with competing board technologies,Journal of Electronic Packaging, Transactions of the ASME , 2017, 139(2):020907-020907-8, DOI:10.1115/1.4036403, SJR=0.569, IF(Q2)=2.21 - 2017 - в издания, индексирани в Scopus или Web of Science
    11. Aliakbar Soleymani Koohbanani, Board-Level Thermal Management Systems with Application in Electronics and Power Electronics, SIMON FRASER UNIVERSITY, Canada, 2016, pp. 80, Thesis - 2016 - от чужди автори в чужди издания, неиндексирани в Scopus или Web of Science
    12. Anunciação, N.C., Oliveira, T.S.L., Anflor, C.T.M.,The influence of thermal barriers in anisotropic media applied to PCB using MEC, Proceedings of the 7th International Conference on Coupled Problems in Science and Engineering, COUPLED PROBLEMS,Editors: M. Papadrakakis, E. Oñate and B. Schrefler, Spain, 2017, pp. 1273-1284, ISBN: 978-849469092-1 - 2017 - в издания, индексирани в Scopus или Web of Science
    13. Lakshminarayanan, V., Soundarakumar, M., Thermal effects in a printed circuit board due to heat emission from mounted components, 2017 IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2017, Gothenburg, art. No. 7993173, pp.101-108, ISBN: 978-153863055-6, DOI: 10.1109/NORDPAC.2017.7993173 - 2017 - в издания, индексирани в Scopus или Web of Science
    14. Thermal Issues Posed by Compact Packaging and IoT for Next Generation SSL, Luger Research e.U. , LED Professional Review (LPR) MAGAZINE, Jan 15, 2018, ISSN 1993-890X - 2018 - от чужди автори в чужди издания, неиндексирани в Scopus или Web of Science
    15. Shen, Y., Wang, H., Blaabjerg, F., Thermal resistance modelling and design optimization of PCB vias,Microelectronics Reliability, Vol. 88-90, pp.1118-1123, 2018, ISSN: 00262714, DOI: 10.1016/j.microrel.2018.07.028, SJR=0.388, IF=1.236 - 2018 - в издания, индексирани в Scopus или Web of Science
    16. Yasushi Koito, Yoshihiro Kubo, Toshio Tomimura, Numerical analysis of printed circuit board with thermal vias: Heat transfer characteristics under nonisothermal boundary conditions, Journal of Electronics Cooling and Thermal Control, 2013, 3, pp. 136-143, ISSN: 2162-6162 - 2013 - от чужди автори в чужди издания, неиндексирани в Scopus или Web of Science
    17. Tawanda Mushiri, Charles Mbohwa, Analysising the Effect of Heat on Layers of a Printed Circuit Board, 6th Int'l Conference on Mechanical, Production & Automobile Engineering (ICMPAE'2014) Nov. 27-28, 2014, South Africa, pp.16-20, Corpus ID: 16070799 - 2014 - от чужди автори в чужди издания, неиндексирани в Scopus или Web of Science
    18. Y. Shen, H. Wang, F. Blaabjerg, H. Zhao and T. Long, Thermal Modeling and Design Optimization of PCB Vias and Pads, IEEE Transactions on Power Electronics, vol. 35, no. 1, pp. 882-900, Jan. 2020, DOI: 10.1109/TPEL.2019.2915029, ISSN 08858993, SJR = 2.51 - 2020 - в издания, индексирани в Scopus или Web of Science
    19. Y. Shen, H. Zhao, T. Long, H. Wang and F. Blaabjerg, Two-Dimensional Thermal Modeling and Parametric Optimization of Printed Circuit Board Vias, 2019 IEEE Energy Conversion Congress and Exposition (ECCE), Baltimore, MD, USA, 2019, pp. 4931-4936, doi: 10.1109/ECCE.2019.8912927 - 2019 - в издания, индексирани в Scopus или Web of Science
    20. Devin A. Smarra, Michael C. Wicks, Vamsy P. Chodavarapu, A Study of the Heat Spreading Capabilities of Mass Via Arrays, 2019 IEEE National Aerospace and Electronics Conference (NAECON), 15-19 July 2019, USA, DOI: 10.1109/NAECON46414.2019.9058183 - 2019 - в издания, индексирани в Scopus или Web of Science
    21. Jianwen Shao, Frank Wei, Xin Zhao, James Solovey, Thermal Solutions for Surface Mount Power Devices, PCIM Europe digital days 2020, 7-8 July 2020, Germany, Print ISBN:978-3-8007-5245-4 - 2020 - в издания, индексирани в Scopus или Web of Science
    22. Nikolay Kalugin, Mikhail Firsov, Andrey Matveev, Experimental estimation of PCB thermal resistance for different configurations and types of vias, PCIM Europe digital days 2020, 7-8 July 2020, Germany, Print ISBN:978-3-8007-5245-4 - 2020 - в издания, индексирани в Scopus или Web of Science

    Вид: пленарен доклад в международен форум, публикация в реферирано издание, индексирана в Web of Science