Autors: Stoynova, A. V., Bonev, B. B., Brayanov, N.
Title: Thermographic Approach for Reliability Estimation of PCB
Keywords: РСВ, reliability, thermographic inspection, non-destructive testing, thermal imaging

References

    Issue

    Proceedings of the International Spring Seminar on Electronics Technology, vol. 2018-May, pp. 8443675, 2018, Serbia, DOI 10.1109/ISSE.2018.8443675

    Цитирания (Citation/s):
    1. P. Boriskov, Y. Ershova, V. Putrolaynen, P. Seredov, M. Belyaev, "Modeling the temperature distribution of multi-chip integrated circuits combining Wire-Bond and Flip-Chip technologies", Journal of Physics: Conference Series, vol. 1399, no. 2, p. 022036, 2019, ISSN: 1742-6588, DOI: 10.1088/1742-6596/1399/2/022036 - 2019 - в издания, индексирани в Scopus или Web of Science
    2. Qiu, T., Andrew Tek, C.K., Huang, S.Y., “A compact high-resolution resonance-based capacitive sensor for defects detection on PCBAs”, vol. 8, pp. 203758-203768, ISSN: 21693536, DOI: 10.1109/ACCESS.2020.3036884 - 2020 - в издания, индексирани в Scopus или Web of Science
    3. J. Bohigas, “Developments for an embedded and reliable floating gate dosimeter”, Universitat de les Illes Balears, Thesis - 2019 - от чужди автори в чужди издания, неиндексирани в Scopus или Web of Science
    4. K. Dziarski, “Selection of the Observation Angle in Thermography Temperature Measurements with the Use of a Macro Lens”, Proceedings of the 13th International Conference on Measurement (MEASUREMENT 2021), p. 9446826, pp. 101-104 - 2021 - в издания, индексирани в Scopus или Web of Science

    Вид: постер/презентация в международен форум, публикация в издание с импакт фактор, публикация в реферирано издание, индексирана в Scopus