Autors: Stoynova, A. V., Bonev, B. B., Brayanov, N.
Title: Thermographic Approach for Reliability Estimation of PCB
Keywords: РСВ, reliability, thermographic inspection, non-destructive



    Proceedings of the International Spring Seminar on Electronics Technology, vol. 2018-May, pp. 8443675, 2018, Serbia, DOI 10.1109/ISSE.2018.8443675

    Цитирания (Citation/s):
    1. P. Boriskov, Y. Ershova, V. Putrolaynen, P. Seredov, M. Belyaev, "Modeling the temperature distribution of multi-chip integrated circuits combining Wire-Bond and Flip-Chip technologies", Journal of Physics: Conference Series, vol. 1399, no. 2, p. 022036, 2019, ISSN: 1742-6588, DOI: 10.1088/1742-6596/1399/2/022036 - 2019 - в издания, индексирани в Scopus или Web of Science
    2. Qiu, T., Andrew Tek, C.K., Huang, S.Y., “A compact high-resolution resonance-based capacitive sensor for defects detection on PCBAs”, vol. 8, pp. 203758-203768, ISSN: 21693536, DOI: 10.1109/ACCESS.2020.3036884 - 2020 - в издания, индексирани в Scopus или Web of Science
    3. J. Bohigas, “Developments for an embedded and reliable floating gate dosimeter”, Universitat de les Illes Balears, Thesis - 2019 - от чужди автори в чужди издания, неиндексирани в Scopus или Web of Science
    4. K. Dziarski, “Selection of the Observation Angle in Thermography Temperature Measurements with the Use of a Macro Lens”, Proceedings of the 13th International Conference on Measurement (MEASUREMENT 2021), p. 9446826, pp. 101-104 - 2021 - в издания, индексирани в Scopus или Web of Science
    5. Hulewicz A., Dziarski K., Drużyński Ł., Dombek G., “Thermogram Based Indirect Thermographic Temperature Measurement of Reactive Power Compensation Capacitors”, Energies, vol. 16, no. 5, p. 2164 - 2023 - в издания, индексирани в Scopus или Web of Science

    Вид: постер/презентация в международен форум, публикация в издание с импакт фактор, публикация в реферирано издание, индексирана в Scopus