Autors: Videkov, V. H., Tsenev, V. P.
Title: Soldering of sensitive components by screen method and surface mounting
Keywords: Heat sensitive, Lower temperatures, Reflow temperatures, Sensitive components, Soldering pastes, Surface mounting, Temperature profiles, Thermal screen

Abstract: This report presents a new method for soldering of heat-sensitive elements. The main path to solving this issue is the use of lower temperature soldering pastes, corresponding reflow temperature profiles and shorter soldering times. However, when the rest of the scheme does not require this, or a standard reflow profile is required, the sensitive components are also manually installed. The essence of the presented method is to use additional heat screens placed over the sensitive components. The screens can be placed either manually or by machine. The screens themselves are analogous to surface mounting elements and can be of different heat mass. Experimental results of temperature profile change using thermal screens are presented



    Proceedings of the International Spring Seminar on Electronics Technology, 42nd International Spring Seminar on Electronics Technology,15 May 2019 through 19 May 2019, vol. Volume 2019-May, issue 42, pp. Article number 8810281, 2019, Poland, IEEE Computer Society, DOI 10.1109/ISSE.2019.8810281

    Copyright IEEE

    Вид: пленарен доклад в международен форум, публикация в реферирано издание, индексирана в Scopus