Autors: Tsenev, V. P.
Title: Sustainable and secure soldering of complex components with package bga, lga, flip chip, fi wlcsp, fo wlcsp to star flex pcb using hybrid printing
Keywords: Complex components, Flip chipHybrid printing, Printing proce

Abstract: The application of hybrid printing for the sustainable and secure soldering of complex components with package BGA, LGA, Flip Chip, FI WLCSP, FO WLCSP to the Star Flex PCB is presented. Several types of solder pastes can be applied by means of hybrid print in a single printing process, which in a single reflow process allows different soldering times for different components of the board on which various thermosensitive components may be placed. This allows to obtain low-void solder of thermosensitive or complex components. Experimental results are presented using different solder pastes and various complex components. The analysis was done using microscopy and Xray imaging/analysis

References

    Issue

    Proceedings of the International Spring Seminar on Electronics Technology ,42nd International Spring Seminar on Electronics Technology, vol. Volume 2019-May, issue 42, pp. Article number 8810279, 2019, Poland, IEEE Computer Society, DOI 10.1109/ISSE.2019.8810279

    Copyright IEEE

    Вид: пленарен доклад в международен форум, публикация в реферирано издание, индексирана в Scopus