Autors: Tsenev, V. P.
Title: Post Reflow Repair Technology with Automatic SMD Assembly for Big Volume of Products
Keywords: Automatic mountingdispensing, Manual repairpost reflow, Refl

Abstract: his paper presents a new way of repairs. The technology includes selective dispensing of a suitable gel flux at soldering pads, automatic mounting of the SMD components and a suitable temperature profile for the post reflow soldering process. The application of different fluxes and temperature soldering profiles has been studied. The results obtained are compared with the manual repair used in such cases

References

    Issue

    10th National Conference with International Participation, 16 May 2019 through 17 May 2019, vol. ELECTRONICA 2019 - Proceedings, issue 10, pp. Article number 8825624, 2019, Bulgaria, Institute of Electrical and Electronics Engineers Inc., DOI 10.1109/ELECTRONICA.2019.8825624

    Copyright IEEE

    Цитирания (Citation/s):
    1. Ticari ve Askerî Elektronik Cihazlarda Kullanılan Yüzeye Montajlı Yeni Nesil Devre Elemanlarının Tamir Sürecindeki Etkili Faktörler - 2020 - от чужди автори в чужди издания, неиндексирани в Scopus или Web of Science
    2. Анализ материалов для изготовления печатных плат - 2020 - от чужди автори в чужди издания, неиндексирани в Scopus или Web of Science

    Вид: пленарен доклад в международен форум, публикация в реферирано издание, индексирана в Scopus