Autors: Vakrilov, N., Stoynova, A. V., Bonev, B. B.
Title: 3D thermal modelling and verification of power electronic modules
Keywords: CFD analysis; MCPCB modelling; LED lighting, IR thermography

References

    Issue

    Proceedings of the International Spring Seminar on Electronics Technology, vol. 2019-May, pp. 8810307, 2019, Poland, DOI 10.1109/ISSE.2019.8810307

    Цитирания (Citation/s):
    1. Pavelek, M., Frivaldsky, M., Sojka, P., Morgos, J., Electro-thermal modelling and experimental verification of power semiconductor diode, Elektronika ir Elektrotechnika, 26 (2), pp. 48-53 - 2020 - в издания, индексирани в Scopus или Web of Science
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    4. M. Pavelek, M. Frivaldsky,, “Indirect electro-thermal modelling of semiconductor diode using non-linear behavior of volt-ampere characteristic”, Energies, vol. 15, no. 1, p. 154 - 2022 - в издания, индексирани в Scopus или Web of Science
    5. Wan G., Zhang K., Fu K., “A 3-D Finite Difference Method for Obtaining the Steady-State Temperature Field of a PCB Circuit”, IEEE Transactions on Power Electronics, vol. 38, no. 2, pp. 2032-2040 - 2023 - в издания, индексирани в Scopus или Web of Science
    6. N. Evstatieva, B. Evstatiev, “Modelling the Temperature Field of Electronic Devices with the Use of Infrared Thermography”, 13th International Symposium on Advanced Topics in Electrical Engineering (ATEE 2023), p. 9425281 - 2023 - в издания, индексирани в Scopus или Web of Science

    Вид: постер/презентация в международен форум, публикация в издание с импакт фактор, публикация в реферирано издание, индексирана в Scopus и Web of Science