Autors: Vakrilov, N., Stoynova, A. V., Bonev, B. B.
Title: 3D thermal modelling and verification of power electronic modules
Keywords: CFD analysis; MCPCB modelling; LED lighting, IR thermography

References

    Issue

    Proceedings of the International Spring Seminar on Electronics Technology, vol. 2019-May, pp. 8810307, 2019, Poland, DOI 10.1109/ISSE.2019.8810307

    Цитирания (Citation/s):
    1. Pavelek, M., Frivaldsky, M., Sojka, P., Morgos, J., Electro-thermal modelling and experimental verification of power semiconductor diode, Elektronika ir Elektrotechnika, 26 (2), pp. 48-53 - 2020 - в издания, индексирани в Scopus или Web of Science
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    3. N. Evstatieva, B. Evstatiev, “Modelling the Temperature Conditions of a Printed Circuit Board”, 12th International Symposium on Advanced Topics in Electrical Engineering (ATEE 2021), p. 9425281 - 2021 - в издания, индексирани в Scopus или Web of Science
    4. M. Pavelek, M. Frivaldsky,, “Indirect electro-thermal modelling of semiconductor diode using non-linear behavior of volt-ampere characteristic”, Energies, vol. 15, no. 1, p. 154 - 2022 - в издания, индексирани в Scopus или Web of Science

    Вид: постер/презентация в международен форум, публикация в издание с импакт фактор, публикация в реферирано издание, индексирана в Scopus и Web of Science