Autors: Georgieva, M. G., Avdeev, G., Milusheva, V. S., Lazarova, D., Petrova, M. Title: Investigation of the Structure of Copper Coatings Obtained by Chemical Deposition from Formaldehyde-free Solution on Dielectrics Keywords: chemical deposition, copper coatings, formaldehyde-free, wea References Issue
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Цитирания (Citation/s):
1. J.H. Huang, P.S. Shih, V. Renganathan, S.J. Grӓfner, Y.A. Chen, C.H. Huang, C.L. Kao, Y.S. Lin, Y.C. Hung, C.R. Kao, Development of high copper concentration, low operating temperature, and environmentally friendly electroless copper plating using a copper ‐ glycerin complex solution, Electrochimica Acta, 425, (2022), pp. 140710 - 2022 - в издания, индексирани в Scopus или Web of Science
2. Huang, J.-H., Shih, P.-S., Renganathan, V., (...), Hung, Y.-C., Kao, C.R., „A High Copper Concentration Copper-Quadrol Complex Electroless Solution for Chip Bonding Applications”, Materials, 17(7),1638, (2024) - 2024 - в издания, индексирани в Scopus или Web of Science
Вид: статия в списание, публикация в издание с импакт фактор, публикация в реферирано издание, индексирана в Scopus