|Autors: Milusheva, V. S., Dimitrov R., Karagyozov T., Tzaneva, B. R., Videkov, V. H.|
Title: Copper electrodeposition into nanoporous template on aluminium substrate
Keywords: anodic aluminium oxide; copper nanowires; electrodeposition; nanoporous template
Abstract: Copper nanowires are of particular importance for microelectronics to produce microcontacts and anisotropic conducting composite layers. The fabrication of copper nanowires has been the subject of a number of investigations. However, there is no systematic study of the influence of experimental electrodeposition conditions on the rate and uniformity of filling the nanoporous aluminium oxide matrix on aluminium substrate. In this work, the dependence of copper electrodeposition into the nanoporous Al2O3 on electrical parameters of galvanostatic and potentiostatic electroplating modes was investigated. It has been established that a more homogenous copper pores filling was observed at cathodic current density of 2 mA/cm2 under galvanostatic conditions or at - 450 mV (vs. SCE) under potentiostatic conditions. The uniformity of the nanoporous template filling is examined by cross-sectional observations with optical and scanning electron microscopy.
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