|Autors: Andonova, A. V., Georgieva, V. M., Kim N., Vakrilov N., Bonev B.|
Title: Quality Control of Chip on Board LED Packaging by Transient Thermography
Keywords: quality control, COB LED, infrared thermography, NDE
Abstract: A new methodology of infrared thermography (IRT) measurements for quality control of chip on board light emitting diode (COB LED) package is studied and presented. For this goal information measuring system and appropriate additional software is developed and used. COB LED samples are prepared with different kind of defects are prepared. Results from using some suitable IRT methods of passive-, pulsed-, lock in-, FMTWI-thermography are shown and relevant image processing methods are used and discussed.
Full text of the publication
1. Hollstein K., Entholzner D., Zhu G., et al., Developing a micro-thermography system for thermal characterization of LED packages, Microelectronic Engineering (2021), https://doi.org/10.1016/j.mee.2021.111694 - 2021 - в издания, индексирани в Scopus или Web of Science
Вид: публикация в международен форум, публикация в издание с импакт фактор