Autors: Gjosheva, S, R., Denishev, K. H.
Title: MICROMECHANICAL TEMPERATURE SENSOR
Keywords: MEMS, Si-Al Termocouple, Thermocouple sensor battery, Sensitivity

Abstract: There are several possibilities for creating temperature sensors. Different principles and technological processes and sequences could be used. One of the simplest constructions is that, using thermocouples. In this case, different contact materials could be used. The choice is made by estimation of the chosen technology, the availability of technological equipment and materials, the application of the device, the parameters obtained by the sensor. In this case, a semiconductor sensor is designed. One of the materials, participated in the thermocouple is silicon (Si) of the base wafer.

References

  1. Van Herwaarden, A, W,Sarro M, P.,, 1986, Thermal sensors, based on the Seebeck effect, Sensors and Actuators, Volume 10, pp. 321-346
  2. Van Oudheusden, B, W.,, 1988, Silicon flow sensors, IEE Proc, Volume 135, pp. 373-380

Issue

ELECTRONICS’ 2005,21 – 23 September, vol. 5, pp. 168-173, 2005, Bulgaria,

Вид: пленарен доклад в международен форум