Autors: Videkov, V. H., Andreev, S. K., Jordanov, S, N., Tzanova, S. S., Arnaudov, R. G.
Title: LEAD FREE SOLDERING ON CONTACT PADS
Keywords: soldering, soldering alloys, SMT

Abstract: In this article are presented results from the investigations of some peculiarities in the process of soldering on small topological forms in PCBs. The investigation is dedicated to the surface mount technology and deals with lead contained and lead free solder alloy pastes. Attention is paid on the implementation of contact pads with lead free surface finish. For this purpose are used galvanic deposited coatings and different solders. The results are obtained when using temperature profiles of typical production process at regimes, recommended by the solder paste vendors. In the experi

References

  1. Mingyu, L., Chunqing, W.,, 2005, International Conference on Electronic Packaging Technology : Solder Joints Design Attribute to No Solder Bridge for Fine Pitch Device, Shanghai , PRC, 2005, <PRC>,
  2. Blackwell, G, R.,, 2000, “Surface Mount Technology” The Electrical Engineering Handbook, USA, CRC Press
  3. Videkov, H, V.,Tzanova, S, S., Andreev, K, S., Mihailova, A, E., Iliev, I, I.,, 1950, ELECTRONICS ET`2004 : A RESEARCH ON SOLDER MASKS USING LEAD AND LEAD-FREE SOLDERS, Sozopol, Bulgaria, September 22-24, <Sofia>, TU-Sofia

Issue

ELECTRONICS’ 2005,21 – 23 September, vol. 5, pp. 32-37, 2005, Bulgaria,

Вид: пленарен доклад в международен форум