Autors: Todorov, G. D., Kamberov, K. H., Sofronov, Y. P. Title: Analysis and Requirements Definition of End Effector Design for a Semiconductor Wafer Handling Keywords: Bernoulli, End effector, Handling, Robotics, WaferAbstract: Presented study is related to end effector design for handling of semiconductor wafers. Design concepts are reviewed and analysed, based on predefined requirements. Two types of gripping - mechanical contact and pneumatic non-contact - are examined. Several design variants of mechanical contact grippers are assessed using virtual prototyping. Advantages of Bernoulli gripper are evaluated and next design step challenges are outlined. It is selected for further concept detailed examination and development. References - Z. He, "Analysis on the development of semiconductor manufacturing process, " Journal of Physics Conference Series, vol. 2295, no. 1, 2022.
- M. Watanabe and S. Kramer, "450 mm Silicon: An Opportunity and Wafer Scaling, " The Electrochemical Society Interface, vol. 1, pp. 28-31, 2006.
- M. Hladik and P. Bhatia, "Improvements in Thin Wafer Handling-Equipment and Material Impacts, " in CS MANTECH Conference, May 19th-22ndDenver, Colorado, USA, 2014.
- SEMI, "SEMI 3D4-Guide for Metrology for Measuring Thickness, Total Thickness Variation (TTV), Bow, Warp/Sori, and Flatness of Bonded Wafer Stacks, " SEMI, 2022.
- X. F. Brun, "Analysis of Handling Stresses and Breakage of Thin Crystalline Silicon Wafers, " Georgia Institute of Technology, Atlanta, Georgia, USA, 2008.
- G. Vacheva, P. Stanchev and N. Hinov, "Modeling and Simulation of Coupled PMSM, " in 2022 14th Electrical Engineering Faculty Conference, BulEF 2022, Varna, 2022.
- K. Nedelchev, M. Semkov and I. Kralov, "Geometric synthesis of fly wheel energy storage design, " in AIP Conference Proceedings, 2021.
- I. Malakov and V. Zaharinov, "Optimization of size ranges of technical products, " Applied Mechanics and Materials, vol. 859, pp. 194-203, 2016.
- S. Davis, J. Gray and D. G. Caldwell, "An end effector based on the Bernoulli principle for handling sliced fruit and vegetables, " Robotics and Computer-Integrated Manufacturing, vol. 24, no. 2, pp. 249-257, 2008.
- R. Mykhailyshyn and J. Xiao, "Influence of Inlet Parameters on Power Characteristics of Bernoulli Gripping Devices for Industrial Robots, " Applied Sciences, vol. 12, no. 14, p. 7074, 2021.
- P. Maruschak, V. Savkiv, R. Mykhailyshyn, F. Duchon and L. Chovanec, "The analysis of influence of a nozzle form of the Bernoulli gripping devices on its energy efficiency, " in ICCPT 2019: Current Problems of Transport: Proceedings of the 1st International Scientific Conference, Ternopil, Ukraine, 2019.
- T. Giesen, E. Bürk, C. Fischmann, W. Gauchel, M. Zindl and A. Verl, "Advanced gripper development and tests for automated photovoltaic wafer handling, " Assembly Automation, vol. 33, p. 334-344, 2013.
- D. Liu, W. Liang, H. Zhu, C. Teo and K. K. Tan, "Development of a distributed Bernoulli gripper for ultra-T hin wafer handling, " in 2017 IEEE International Conference on Advanced Intelligent Mechatronics (AIM), Munich, Germany, 2017.
- S. Ertürk and F. Erzincanli, "Design and development of a non-contact robotic gripper for tissue manipulation in minimally invasive surgery, " Acta Bio Medica: Atenei Parmensis, vol. 91, p. e2020071, 2020.
- A. C. Bonora and R. G. Hine,"Ultra low contact area end effector". USA Patent US7293811, 13 11 2007.
- T. Giesen, R. Wertz, C. Fischmann, J. Govaerts, J. Vaes, M. Debucquoy and A. Verl, "Advanced Production Challenges for Automated Ultra-Thin Wafer Handling, " in 27th European Photovoltaic Solar Energy Conference and Exhibition, 2012.
Issue
| 2024 59th International Scientific Conference on Information, Communication and Energy Systems and Technologies, ICEST 2024 - Proceedings, 2024, , https://doi.org/10.1109/ICEST62335.2024.10639692 |
|