Autors: Nikolova, B. N., Nikolov, G. N., Krumova R. T. K.
Title: Bending Influence on the Flexible Interdigital Structures
Keywords: bending sensor; flexible substrate; inkjet printing

Abstract: In recent years, there has been a significant increase in interest in the use of flexible sensor structures for various applications. These structures are relatively inexpensive and can be fabricated in different shapes and sizes. The present article investigates three types of flexible capacitive sensor structures with different forms. The influence of bending on their capacitance, impedance, and dielectric losses in the frequency domain has been studied. Some of the obtained results are presented graphically, and an analysis of the properties of the structures has been conducted.

References

  1. Z. Suo, E. Y. Ma, H. Gleskova and S. Wagner, 1999, Mechanics of rollable and foldable film-on-foil electronics, Applied physics letters, Volume 74/8, pp. pp. 1177-1179
  2. Y. Tang and Z. D. Deng, 2019, Stretchable sensors for environmental monitoring, Applied Physics Reviews, Volume 6/1, pp.
  3. S. T. Han, H. Peng, Q. Sun, S. Venkatesh, K. S. Chung, S. Chuen, Y. Zhou and V. A. L. Roy, 2017, An overview of the development of flexible sensors, Advanced Materials, Volume 29/33, pp.
  4. J. C. Costa, F. Spina, P. Lugoda, L. Garcia-Garcia, D. Roggen, N. Müzenrieder, 2019, Flexible sensors - from materials to applications, Technologies, Volume 7/2, pp.
  5. F. Molina-Lopez, T. Kinkeldei, D. Briand, G. Trӧster and N. F. de Rooij, 2013, Theoretical and experimental study of the bending influence on the capacitance of interdigital micro-electrodes patterned on flexible substrates, Journal on Applied Physics, Volume 114/17, pp.
  6. X. Hu and W. Yang, 2010, Planar capacitive sensors - designs and applications, Sensor Review, Volume 30/1, pp. pp. 24-39
  7. George, S.P., Isaac, J., Philip, J., 2020, Performance Assessment of Inter-Digital Capacitive Structure-Finite Element Approach, Advances in Intelligent Systems and Computing, Volume 949, pp. pp. 431-439
  8. Park, S.-I., Ahn, J.-H., Feng, X., Wang, S., Huang, Y., Rogers, J.A., 2008, Theoretical and experimental studies of bending of inorganic electronic materials on plastic substrates, Advanced Functional Materials, Volume 18/18, pp. pp. 2673-2684
  9. Igreja, R., Dias, C.J., 2004, Analytical evaluation of the interdigital electrodes capacitance for a multi-layered structure, Sensors and Actuators, A: Physical, Volume 112/2-3, pp. pp. 291-301
  10. Gieva, E.E., Nikolov, G.T., Nikolova, B.M., Ruskova, I.N., 2019, Impedance measurement of inkjet printed planar structures, 28th International Scientific Conference Electronics, ET 2019 - Proceedings, Volume , pp.
  11. Nikolov, G., Gieva, E., Nikolova, B., Ruskova, I., 2020, The Effect of a pattern of capacitive sensors for liquid level measurements, Proceedings of the International Spring Seminar on Electronics Technology, Volume , pp.

Issue

32nd International Scientific Conference Electronics, ET 2023 - Proceedings, 2023, Bulgaria, ISBN: 979-8-3503-0200-4/DOI: 10.1109/ET59121.2023.10279169

Copyright IEEE

Full text of the publication

Вид: публикация в международен форум, публикация в реферирано издание, индексирана в Scopus