Autors: Videkov, V. H., Radonov, R. I.
Title: Die Packaging Methods and Their Relation to the Layout of Integrated Circuits
Keywords: integrated circuits, bond pads, packaging

Abstract: The paper presents contemporary methods for die packaging. A special attention is paid to the constructive solutions regarding integrated circuits' input/output pads and their relation to the layout of the bond pads. Conclusions have been made about the need of layout planning having in mind the places of the input/output pads and their respective bond pads.


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Annual Journal of Electronics, vol. 4, number 1, pp. 33 - 35, 2010, Bulgaria, ISSN 1313-1842

Вид: статия в списание