Autors: Rusev, R. V., Tsenev, V. P., Videkov, V. H., Katerina Petkovska.
Title: Combined footprint of solder paste - influence of bismuth content on solder strength
Keywords: solder, combined footprint, bismuth, shear test, statistics

References

    Issue

    ET 2023, 2023, Bulgaria, DOI: 10.1109/ET59121.2023.10279260

    Цитирания (Citation/s):
    1. Martin Ralchev, Valentin Mateev, Iliana Marinova, “Low Temperature Soldering of 3D Printed Conductive Polymer Contacts”, 15th Electrical Engineering Faculty Conference (BulEF), September 2023, DOI: 10.1109/BulEF59783.2023.10406262, SJR 0.109. - 2023 - в издания, индексирани в Scopus или Web of Science

    Вид: постер/презентация в международен форум, публикация в реферирано издание, индексирана в Scopus