Autors: Tsenev, V. P., Rusev, R. V., Videkov, V. H., Slavchev, M. K.
Title: Statistical analysis of the influence of the amount of bismuth in a combined solder paste footprint on the content of voids in the solder
Keywords: solder, combined footprint, bismuth, void, statistics

References

    Issue

    InfoTech 2023, 2023, Bulgaria, DOI 10.1109/InfoTech58664.2023.10266874

    Вид: пленарен доклад в международен форум, публикация в реферирано издание, индексирана в Scopus