Autors: G. Kotlarski., M. Ormanova., S. Valkov., A. Andreeva., R. Bezdushnyi., Mateev, V. M., Marinova, I. Y., P. Petrov.
Title: Influence of Transition Metal-Nitride Thin Films on the Electrical Contact Resistance of Copper Substrates
Keywords: Contact resistance; Corrosion resistance; Corrosion resistan

Abstract: In the present study, TiN and VN surface coatings are applied on copper substrates, and their influence on the electrical contact resistance (ECR) of the primary material is studied. The coatings are deposited using reactive magnetron sputtering in an Ar/N2 environment. The formed TiN and VN thin films have a thickness of 600 nm and 350 nm, respectively. The preferred crystallographic orientation of both coatings is in the (311) plane. This corresponds to a high crystallite size, high plastic deformations, and high mobility of any structural defects. The I(200)/I(111) ratios of the coatings indicate that the deposited TiN coating is perfectly stoichiometric, and the VN one is hyper stoichiometric, resulting in its' slightly higher electrical contact resistance. The electrical contact resistance of both coatings is significantly lower compared to that of the pure copper substrate due to their excellent corrosion resistance.

References

    Issue

    22nd International Conference and School on Quantum Electronics, ICSQE 2022, vol. 2487, issue 1, pp. 012033, 2023, Bulgaria, Journal of Physics: Conference Series, DOI 17426588/10.1088/1742-6596/2487/1/012033

    Copyright IOP Publishing Ltd.

    Вид: публикация в международен форум, публикация в реферирано издание, индексирана в Scopus