Autors: Gieva, E. E., Ruskova, I. N.
Title: Investigation and Simulation of the Effect of Laser Heating on Wafers from Different Material
Keywords: Laser heating, laser technologies, semiconductor wafers, COM

Abstract: In this paper, a 3D COMSOL model of a silicon wafer that is heated using a laser moving radially across the wafer surface is implemented. By modelling the incident heat flux from the laser as a spatially distributed heat source on the surface, the transient thermal response of the wafer is obtained. The average, maximum, and minimum temperatures, as well as the peak temperature difference across the substrate, are stored at each calculation step. The temperature distribution throughout the pad is stored at a specified number of output time steps. The study included three wafer models of different materials, silicon, germanium and gallium arsenide, and the results were compared and analysed in order to verify the studied characteristics

References

  1. https://www.laserfocusworld.com/industrial-laser-solutions/article/14221977/laser-processing-technologies-in-the-pcb-industry
  2. Guillaume Savriama and Nadjib Semmar, Numerical Simulation of Laser Processing Materials: An Engineering Approach, Book: Modeling and Simulation in Engineering Sciences, chapter 8, 2016 The Author(s). Licensee InTech
  3. Thin Silicon Wafer Device Concept with Advanced Laser Annealing and Sintering Process M. Rahimo, J. Vobecký, C. Corvasce and Y. Otani, Copyright © [2012] IEEE. Reprinted from the International Seminar on Power Semiconductors. (https://search.abb.com/library/Download.aspx?DocumentID=isps12mr&LanguageCode=en&DocumentPartId=&Action=Launch)
  4. Todorov, G. D, Kamberov, K. H, Ivanov, T. T, 2021, Parametric optimisation of resistance temperature detector design using validated virtual prototyping approach, Case Studies in Thermal Engineering
  5. Zagorski, M. H, Todorov, G. D, Sofronov, Y. P, 2021, DIRECT METAL DEPOSITION FOR HYBRID MANUFACTURING, Journal of the Balkan Tribological Association, pp. 1033-1039
  6. Todorov, G. D, Kamberov, K. H, 2020, Black box/white box hybrid method for virtual prototyping validation of multiphysics simulations and testing, IOP Conference Series: Materials Science and Engineering

Issue

46th International Spring Seminar On Electronics Technology, pp. 1-6, 2023, Romania, DOI 10.1109/ISSE57496.2023.10168404

Вид: публикация в международен форум, публикация в реферирано издание, индексирана в Scopus