Autors: Stoynova, A. V., Bonev, B. B.
Title: Post-processing improvement of lock-in thermography study of MCM-L for better hidden defect localization
Keywords: hidden defects, lock-in thermography, multichip modules, MCM



    International journal of circuits, systems and signal processing, issue 16, pp. 941-947, 2022, United States,

    Цитирания (Citation/s):
    1. Ramos Silva A., Vaz M., Leite S., Mendes J., “Lock-In Thermal Test Simulation, Influence, and Optimum Cycle Period for Infrared Thermal Testing in Non-Destructive Testing”, Sensors, vol. 23, no. 1, p. 325 - 2023 - в издания, индексирани в Scopus или Web of Science

    Вид: статия в списание, публикация в издание с импакт фактор, публикация в реферирано издание, индексирана в Scopus