Autors: Angelov, G. V., Nikolov, D. N., Rusev, R. V., Rusev, R. P.
Title: Application of B-Scan for identification of delamination in Integrated Circuits
Keywords: A-scan; B-Scan; C-scan; Delamination; RTG; SAM

Abstract: In this paper the application of B-Scan mode of surface acoustic microscopy for detection of delamination is investigated. Delamination is a common defect found in integrated circuits. It consists of presence of air cavities between layers in encapsulated integrated circuits. B-Scan is a technique for vertical inspection of the layers composing the device under test. The use of B-Scan mode to unambiguous identify the presence or absence of delamination is examined in details. The results are verified by A-Scan and 180°-phase shift of the reflected signal. © 2022 IEEE.

References

  1. Hutter, M. Find Defects in IC Packages (1999) Berlin, Germany [Online], https://www.edn.com/find-defects-in-icpackages/
  2. Electronics Materials-Coefficient of Thermal Expansion [Online]. http://www.idconline.com/technical_references/pdfs/electronic_engineering/Electronics_Materials_Coefficient_of_Thermal_Expansion.pdf
  3. Ju, Y., Saka, M., Abé, H. Detection of delamination in IC packages using the phase of microwaves (2001) NDT and E International, 34 (1), pp. 49-56. Cited 11 times. doi: 10.1016/S0963-8695(00)00044-X
  4. Subramanian, K.N., Lee, A., Choi, S., Sonje, P. Material issues in electronic interconnects and packaging (2001) Journal of Electronic Materials, 30 (4), pp. 372-378. Cited 19 times. doi: 10.1007/s11664-001-0046-7
  5. Rebollo, F. How it works Scanning Acoustic Microscopy (CSAM) Altertechnology.com Online] https://wpoaltertechnologycom/how-it-works-scanning-Acoustic-microscopy-csam/
  6. Lei, W.-S., Kumar, A. Delamination and Reliability Issues in Packaged Devices (2014) Adhesion in Microelectronics, 9781118831335, pp. 267-312. Cited 13 times. http://www.wiley.com/remtitle.cgi?isbn=1118831330 ISBN: 978-111883133-5; 978-111883137-3 doi: 10.1002/9781118831373.ch7
  7. Hurchinson, J. Sresses and failure modes in thin films and multilayers (1996) Groups.seas.harvard.edu/ Technical University of Denmark, [Online] https://groups.seas.harvard.edu/hutchinson/papers/462-5.pdf
  8. Usell Jr., R.J., Smiley, S.A. EXPERIMENTAL AND MATHEMATICAL DETERMINATION OF MECHANICAL STRAINS WITHIN PLASTIC IC PACKAGES AND THEIR EFFECT ON DEVICES DURING ENVIRONMENTAL TESTS. (1981) Annual Proceedings - Reliability Physics (Symposium), pp. 65-73. 
  9. Ahmad, T. The Development of New Backside Decapsulation Technique to Investigate Integrated Circuit Failure in the Automotive Application Environment", Docplayer.net [Online], https://docplayer.net/50922052-The-development-of-new-backsidedecapsualtion-Technique-To-investigate-integrated-circuit-failure-inthe-Automotive-Application-environment.html
  10. Angelov, G., Rusev, R., Nikolov, D., Rusev, R. Identifying of Delamination in Integrated Circuits using Surface Acoustic Microscopy (2021) 2021 30th International Scientific Conference Electronics, ET 2021 - Proceedings. Cited 2 times. http://ieeexplore.ieee.org/xpl/mostRecentIssue.jsp?punumber=9579469 ISBN: 978-166544518-4 doi: 10.1109/ET52713.2021.9579909
  11. (2022) X-Ray Tomography, 26. Scanning Acoustic Microscopy (SAM) April, doeeet.com, [Online], https://www.doeeet.com/content/testing-eee-parts/inspectionelectrical-verification/scanning-Acoustic-microscopy-sam-And-x-raytomography/
  12. NexGen Scanning Acoustic Microscopeirp.cdnwebsite.com [Online], Available OKOS, Vue 400-P- https://irp.cdnwebsite.com/2129f79d/files/uploaded/OKOS%202020%20%20VUE%20400-P%20NEXGEN.pdf
  13. Wiki.okos.com OKOS Delamination Detection, [Online], http://wiki.okos.com/index.php/Delamination_Detection
  14. Irp.cdn-website.com, [Online], Available OKOS Transducers https://irp.cdn-website.com/2129f79d/files/uploaded/OKOS%202018-%20Transducers.pdf
  15. Mehr, M.Y., Bahrami, A., Fischer, H., Gielen, S., Corbeij, R., Van Driel, W.D., Zhang, G.Q. An overview of scanning acoustic microscope, a reliable method for non-destructive failure analysis of microelectronic components (2015) 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015, art. no. 7103077. Cited 17 times. ISBN: 978-147999950-7 doi: 10.1109/EuroSimE.2015.7103077

Issue

ET 2022, pp. 1-4, 2022, Bulgaria, Institute of Electrical and Electronics Engineers Inc., DOI 10.1109/ET55967.2022.9920294

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