| Autors: Tsenev, V. P., Nedyalko Peshev. Title: Measurement and analysis of the peel strength for solder joints in LGA electronic assembly using statistical methods Keywords: soldering, peel strength, intelligent measuring system, stat Abstract: The presented article examines the strong of solders after LGA (Land grid array) soldering. The strонг of the solders is evaluated with the maximum breaking strength. The methodology for measuring the breaking force and the implementation of the intelligent measuring system for this are presented. With the application of intelligent measuring systems and the use of machine learning, results have been obtained that meet the specification of the studied process. The results obtained by statistical processing are analyzed. An assessment has been made in terms of a specific application. Conclusions are made regarding the achieved and future development for stabilization and guarantee of the soldering process with Hot bar. References Issue
|
Вид: публикация в национален форум с межд. уч., публикация в реферирано издание, индексирана в Scopus
