Autors: Hadzhiev, I. S., Malamov, D. V., Yatchev, I. S.
Title: Influence of overall dimensions and materials of a switchboard on the thermal field distribution
Keywords: computer model, thermal field, low voltage switchboard.

Abstract: This paper employs a computer model for investigation of the thermal field in a low voltage (LV) switchboard. The model has been synthesized in the software product Comsol. The thermal field has been modelled taking into account the thermodynamic processes and heat transfer by radiation in the volume of the LV switchboard. Comparison has been drawn between the results, obtained from the model and the results of the experiment. Results, concerning the influence of both the volume and the material of the enclosure on the switchboard heating have been obtained by means of the computer model.


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18th International Symposium on Electrical Apparatus and Technologies, SIELA 2014 - Proceedings, Bourgas, Bulgaria, ISBN 978 1-4799-5817-7, DOI: 10.1109/SIELA.2014.6871860, pp. 1-4, 2014, Bulgaria, DOI 10.1109/SIELA.2014.6871860

Copyright IEEE

Цитирания (Citation/s):
1. Odak, M., Stegic, J., Erceg, I., Sumina, D., Rendulic, Z., Topcagic, E. "Thermal Simulation Analysis of Control Cabinet Connection Technology Using Laminated Conductors" (2022) 45th Jubilee International Convention on Information, Communication and Electronic Technology, MIPRO 2022 - Proceedings, pp. 89-94, DOI: 10.23919/MIPRO55190.2022.9803590 - 2022 - в издания, индексирани в Scopus или Web of Science

Вид: публикация в международен форум, публикация в реферирано издание, индексирана в Scopus и Web of Science