Autors: Tsenev, V. P.
Title: Methodology for analysis of defects in electronic assembly using Xray
Keywords: defect, analysis, Xray, assembly, electronics

References

    Issue

    IEEE XXVII INTERNATIONAL SCIENTIFIC CONFERENCE “ELECTRONICS ET 2018”, 2018, Bulgaria, DOI: 10.1109/ET.2018.8549637

    Цитирания (Citation/s):
    1. A serial-timing multi-channel CMOS charge readout ASIC for X-ray detectors - 2021 - в издания, индексирани в Scopus и/или Web of Science
    2. Recursive CNN Model to Detect Anomaly Detection in X-Ray Security Image - 2022 - в издания, индексирани в Scopus и/или Web of Science
    3. Sascha Senck, Boris Komljen, Sarah Heupl, Patrick Weinberger, Simon Zabler, Till Huesgen, Stephan Kasemann, Otto Kreutzer, “Non-destructive testing of electronic components using X-ray computed laminography and tomography”, 10th International Symposium on Digital Industrial Radiography and Computed Tomography, DIR2025, Paris, France, 2025, e-Journal of Nondestructive Testing - ISSN 1435-4934 - www.ndt.net - 2025 - от чужди автори в чужди издания, неиндексирани в Scopus или Web of Science

    Вид: пленарен доклад в международен форум, публикация в реферирано издание, индексирана в Scopus