Autors: Tsenev, V. P., Peshev, N. S.
Title: Stabilizing the Strength of Solders in LGA Electronic Assembly by Different Design of Pads and Using of Statistical Evaluation Methods
Keywords: hybrid module; soldering; breaking force; design; statistics

Abstract: The article describes the study of the strength of solders in LGA (Land grid array) assembly. The influence of the design of the pads of the boards on the strength of the solders is considered. The breaking force measurement was performed with a specialized intelligent measurement system. Statistical methods were used to analyze the breaking force of solders. Best design conclusions regarding solder strength are drawn and future research to obtain stable and strong solders is suggested.

References

    Issue

    2022 XXXI International Scientific Conference Electronics (ET), 2022, Bulgaria, DOI 10.1109/ET55967.2022.9920210

    Вид: пленарен доклад в международен форум, публикация в реферирано издание, индексирана в Scopus